Lapitec® to meet North American distributors in New York in July

Three days dedicated to updating and sharing the new initiatives to be presented by Lapitec in 2019: these are the objectives of the event which from 18 to 20 July will see the Italian company’s US and Canadian distributors gather in the Big Apple. The event, which comes just a few days after another dedicated to the European market, will be held at the headquarters and showroom of Lapitec’s New York distributor ABC Stone in Manhattan, at the heart of the city’s most central and exclusive district.
 
During the sessions, a number of key themes will be explored: the new concept colours, the technologies being developed and the Lapitec® offering dedicated to architects, with a special focus on BIM objects. The event will also provide an opportunity to take an in-depth look at certain more technical aspects, though a talk from Mike Picco, a veritable authority in the field of cladding, facades and anchoring systems. Picco is President and Founder of PICCO Engineering and is an active member of the Canadian Standard Association technical committee, Chief Consultant to The Terrazzo Tile and Marble Association of Canada. Voted onto the Marble Institute of America’s Board of Directors in 2015 (now Natural Stone Institute), Michael is serving a 7 year term as Canada’s representative to the NSI and will be President in 2022. Also taking part in the event will be Ardex, a renowned manufacturer of adhesives, who will illustrate developments in flooring glues, one of the most common applications for Lapitec®.
 
“The United States and Canada”, confirmed Marcello Toncelli, Vice President of Marketing for Lapitec®, “has always been a market that we have paid close attention to and where we have enjoyed steady growth for several years. The opportunity to meet with our distributors is undoubtedly an important circumstance for sharing both the journey up to this point, and the technological developments and products that will be implemented in the short and medium term.